Technical Workshop Announcement

LED's thermal simulation, packaging materials testing and analysis of lighting products Certification FAQ

Time: July 18, 2013 Thursday, 13:30-17:30

Location: Foshan LED-FPD Hong Kong University of Engineering and Technology Research and Development Center

Address: Foshan Nanhai District Road 17 Han-day deep-sea Technology City 304, 3rd Floor, Building A, Unit 7

 

Workshop Summary

LED package built on the mechanical, thermal, optical and electrical properties of the basis of rational use of materials testing and therefore critical to the performance. "LED packaging materials testing and process optimization" from the phosphor deposition, silica gel cracking, silver plastic black LED packaging industry and other thorny issues commonly encountered starting materials testing and project development based on experience, analyze cause of the problem, propose solutions suggested. Heat detection and thermal simulation method can be used for junction temperature / resistance quantization, in addition, parameterized thermal simulation studies to the LED product development to provide directional guidance to shorten the product development cycle and cost savings. This workshop is based in the center conducted its own research and development and the actual work of external services, explained one by one from the LED chip level, board-level to system level thermal performance testing / simulation and thermal management issues and, through parametric study hot on the part of the product design direction. In addition, the workshop gave a detailed account Lighting national product safety certification requirements and analytical testing process will often encounter which does not meet the conditions and how to avoid unnecessary product rectification.